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High Purity Oxygen (O2) Specialty Gases

  • DoT Shipping Name Oxygen Compressed
  • DOT Classification 2.2
  • DOT Label Non-flammable Gas
  • UN Number UN 1072
  • CAS NO. 7782-44-7
  • CGA/DISS/JIS/BS341/DIN477 540/714/W22-14R/NO.3/NO.9
  • Shipped as Compressed Gas

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Specifications 

Purity , % 99.995 99.999 99.9997
Argon ≤1.0 ppmv 
Nitrogen ≤25.0  ppmv ≤5.0 ppmv  ≤1.0 ppmv 
Carbon Dioxide ≤0.5 ppmv  ≤0.1 ppmv  ≤0.1 ppmv 
Carbon Monoxide  ≤0.5 ppmv  ≤0.1 ppmv  ≤0.1 ppmv 
THC ( CH4) ≤0.5 ppmv  ≤0.1 ppmv  ≤0.1 ppmv 
Water  ≤2.0 ppmv  ≤0.5 ppmv  ≤0.1 ppmv 
Argon ≤3.0 ppmv  ≤3.0 ppmv 
Hydrogen ≤1.0 ppmv  ≤0.1 ppmv  ≤0.1 ppmv 

Technical Information

Cylinder State @ 21.1°C  Gas
Flammable Limits In Air  Non-flammable 
Auto Ignition Temperature (°C ) -
Molecular Weight (g/mol) 31.999
Specific gravity (air =1) 1.105
Critical Temperature ( °C ) -118.57
Critical Pressure ( psig ) 714.4

Description 

Oxygen is a chemical element; it has symbol O and atomic number 8. It is a member of the chalcogen group in the periodic table, a highly reactive nonmetal, and an oxidizing agent that readily forms oxides with most elements as well as with other compounds. Oxygen is the most abundant element in Earth's crust, and after hydrogen and helium, it is the third-most abundant element in the universe. At standard temperature and pressure, two atoms of the element bind to form dioxygen, a colorless and odorless diatomic gas with the formula O2. Diatomic oxygen gas currently constitutes 20.95% of the Earth's atmosphere, though this has changed considerably over long periods of time. Oxygen makes up almost half of the Earth's crust in the form of oxides.

Common uses of oxygen include production of steel, plastics and textiles, brazing, welding and cutting of steels and other metals, rocket propellant, oxygen therapy, and life support systems in aircraft, submarines, spaceflight and diving.

Applications

● As a component in calibration gas .
● In first-aid treatment of emergencies such as suffocation and heart attack .
● In the treatment of patients with respiratory disorders .
● In anaesthesia .
● In chemical oxidation reaction studies .
● In semiconductor fabrication, chemical vapour deposition of silicon dioxide .
● In semiconductor fabrication, thermal oxide growth .
● In semiconductor fabrication, plasma etching .
● In semiconductor fabrication, plasma stripping of photoresist .
● In semiconductor fabrication, carrier gas in certain deposition/diffusion operations.

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